ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,822, issued on Nov. 3, was assigned to Analog Devices Inc. (Wilmington, Mass.). "Integrated electronic module with laminated bridge assembly... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,823, issued on Nov. 3, was assigned to Analog Devices Inc. (Wilmington, Mass.). "Stacked vertical power module" was invented by John David B... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,824, issued on Nov. 3, was assigned to KYOCERA Corp. (Kyoto, Japan). "Semiconductor package and semiconductor electronic device" was invente... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,825, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce impedance discontinuities and cro... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,826, issued on Nov. 3, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufactur... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,827, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Multi-die QFN hybrid package" was invented by Hsin-Long Chen (... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,828, issued on Nov. 3, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor de... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,829, issued on Nov. 3, was assigned to Absolics Inc. (Covington, Ga.). "Packaging substrate having cavity portions and method of manufacturi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,830, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and substrate for sem... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,831, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package having a double via" was... Read More